
Manufacturer Part #
AT27C512R-70JU
AT27C512R Series 5.5 V 512 Kb (64 K x 8) 70 ns Through Hole EPROM OTP - PLCC-32
Microchip AT27C512R-70JU - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of MMT as new final test site for selected AT27C040, AT27C080, AT27LV040A, AT28HC256, AT28HC256E, AT28C256, AT28BV256, AT28C256EF, AT27C010, AT28HC64BF, AT28BV64B, AT27BV256, AT27LV256A, AT28HC64B, AT27BV010, AT28C64B, AT27C256R, AT27LV010A, AT27LV020A, AT27C512R, AT27C020 and AT27LV512A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated Qualification Completion Date: June 2025
Part Status:
Microchip AT27C512R-70JU - Technical Attributes
Memory Density: | 512kb |
Memory Organization: | 64K x 8 |
Supply Voltage-Nom: | 4.5V to 5.5V |
Access Time-Max: | 70ns |
Temperature Grade: | Industrial |
Package Style: | PLCC-32 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
32 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount