Manufacturer Part #
FM28V202A Series 2 Mb (128 K × 16) 3.6 V F-RAM Memory - TSPO II-44
|Standard Pkg:|| |
Product Variant Information section
135 per Tray
Subject: Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM ProductsDescription of Change: Cypress is planning to qualify new sources of supply for select RAM products currently running at JCET (78 Changshan Rd, Jiangyin, Jiangsu, China 214400) and OSET (12-2 Nel Huan South Rd. N.E.P.Z. Kaohsiung, Taiwan 811, R.O.C.). The products will be qualified at the following sites already utilized by Cypress for similar packages: a. Greatek Taiwan for Assembly, Test, and Finish (No.136, Gon-Yi Rd. Zhunan Township, Miaoli County 350 Taiwan, R.O.C.) b. UTAC Thailand for Assembly, Test, and Finish (237 Lasalle Road, Sukhumvit 105 Bangna, Bangkok 10260 Thailand) c. Unimos China for Assembly (9688 Songze Ave., Qingpu Industrial Zone, Shanghai, China) d. KYEC Taiwan for Test and Finish (No. 81, Sec.2, Gongdaowu Rd., Hsin-Chu 300, Taiwan, R.O.C.) e. Cypress Philippines for Assembly, Test, and Finish (Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines) f. Cypress Bangkok for Assembly, Test, and Finish (229 Moo 4 Changwattana Road, Bangkok, Thailand) These sites are qualified to build standard and automotive grade products consistent with AEC-Q100/AEC-Q006 standards. Benefit of Change: Cypress will have the capability to meet market demand, and to ensure consistent and reliable delivery performance to customers. It is important, especially in the current pandemic situation, to establish alternate sources of supply. Qualification Status: Estimated dates for completion of the qualifications are provided in this notification. Document No. 001-53348 Rev.*H Page 3 of 3 Approximate Implementation Date: Estimated implementation dates are provided in this notification. Given the criticality of establishing alternate sources of supply, it is important that we enable these sources expeditiously. Anticipated Impact: No impact to form, fit and function is expected.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Addendum to PCN 170501 (Future PCN# 52360): Qualification of Texas Instruments' DMOS6 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for 2Mb F-RAM Serial Product FamilyDescription of Change: The purpose of this addendum is to add parts to the parts list that were not included in the original PCN. The added part numbers can be identified in the affected parts list with PCN170501A in column D.
|FRAM Type:||Non Volatile|
|Memory Organization:||128 K x 16|
|Supply Voltage-Nom:||2V to 3.6V|
|Temperature Range:||-40°C to +85°C|
|Package Style:||TSOP II-44|
|Mounting Method:||Surface Mount|
135 per Tray