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Manufacturer Part #
24AA01HT-I/OT
24AA01HT-I/OTMCPEMEA1K, 128 X 8 SERIAL EE, 1.8V IND, 1/2 ARRAY WPN0.150000
Microchip 24AA01HT-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Product Documents for the 24AA01H/24LC01BH 1-Kbit I2C Serial EEPROM with Half-Array Write-Protect of devices.Notification Status: FinalDescription of Change: 1) Updated formatting to current template. 2) Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client? respectively. 3) Updated MSOP, PDIP, SC70, SOIC, SOT-23, TDFN and TSSOP package drawings.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 Nov 2021
Part Status:
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg