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Manufacturer Part #
CY7C1425KV18-300BZXC
Sync QDR II Memory IC 36Mbit Parallel 300 MHz FBGA Tray
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:136 per Tray Package Style:FBGA-165 Mounting Method:Surface Mount |
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| Date Code: | 2513 | ||||||||||
Infineon CY7C1425KV18-300BZXC - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Detailed change informationSubject: Change of label affecting dedicated Memory Solutions products: addition of HAL-free markReason:Standardization of labelling for Infineon products. Deeper integration of supply chain and detailed assessment confirmed HAL-free products in Infineon portfolio. Deliveries will start with 25.02.2025 to cascade information to Infineon customers with utmost urgency.Intended start of delivery 2025-02-25
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Part Status:
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Infineon CY7C1425KV18-300BZXC - Technical Attributes
| Memory Density: | 36Mb |
| Memory Organization: | 4M x 9 |
| Supply Voltage-Nom: | 1.7V to 1.9V |
| Temperature Grade: | Commercial |
| Speed: | 300MHz |
| Number of Words: | 4M |
| Word Length: | 9b |
| Supply Current: | 680mA |
| Interface Type: | Parallel |
| Operating Temp Range: | 0°C to 70°C |
| Storage Temperature Range: | -65°C to +150°C |
| Moisture Sensitivity Level: | 3 |
| Package Style: | FBGA-165 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
136 per Tray
Package Style:
FBGA-165
Mounting Method:
Surface Mount