Manufacturer Part #
MX30UF2G18AC-XKI
2Gb (x8) SLC NAND 1.8V 4-bit ECC 63-ball FBGA
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| Mfr. Name: | Macronix | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:220 per Tray Package Style:VFBGA-63 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Macronix MX30UF2G18AC-XKI - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
3A991.b.1.a
This item may be subject to export licensing controls.
PCN Information:
File
Date
Material Change
09/23/2025 Details and Download
Change die attach material for ASECL 63CSP package products.Reason of Change:The State of Maine in the United States issued a written notification (H.P.1113 L.D.1503 ) prohibit intentional addition of PFAS Perfluoroalkyl and Polyfluoroalkyl Substances material in all consumer products startingfrom Jan. 2030.Change Description:Please be informed that Macronix is going to replace the die attach material 63CSP package products assembled at ASECL. Before Change : Die attach material (w/ PFAS): Epoxy (Henkel, 2025D)After Change:Die attach material (PFAS-Free): Film (Resonac FH-900)
Part Status:
Active
Active
Macronix MX30UF2G18AC-XKI - Technical Attributes
Attributes Table
| NAND Type: | SLC |
| Memory Type: | Non-Volatile |
| Memory Format: | Flash |
| Memory Density: | 2Gb |
| Memory Organization: | 256 M x 8 |
| Supply Voltage-Nom: | 1.7V to 1.95V |
| Access Time-Max: | 25ns |
| Operating Temp Range: | -40°C to +85°C |
| Additional Feature: | Security Feature |
| Interface: | Parallel |
| Package Style: | VFBGA-63 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
20 Weeks
Quantity
Unit Price
220+
$2.69
Product Variant Information section
Available Packaging
Package Qty:
220 per Tray
Package Style:
VFBGA-63
Mounting Method:
Surface Mount