NEW! Free shipping over $50 USD. Learn more
Manufacturer Part #
SST39VF400A-70-4C-EKE
SST39VF Series 4 Mbit 256 K x 16 3 V Multi-Purpose Flash - TSOP-48
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:96 per Tray Package Style:TSOP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2017 | ||||||||||
Microchip SST39VF400A-70-4C-EKE - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MTAI as an additional Test site location for selected SST39VF400A-70-4Cxx and SST39VF400A-70-4Ixx device families available in 48L TFBGA (6x8x1.2mm) and 48L TSOP (12x20mm) packages.Reason for Change:To improve manufacturability by qualifying MTAI as an additional fab location.Change Implementation Status:In ProgressEstimated First Ship Date:September 1, 2022 (date code: 2236)
Description of Change:Qualification of MTAI as an additional Test site location for selected SST39VF400A-70-4Cxx and SST39VF400A-70-4Ixx device families available in 48L TFBGA (6x8x1.2mm) and 48L TSOP (12x20mm) packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as an additional fab location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2022
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change:Qualification of SIGN as a new assembly site for selected SST39LFxx and SST39VFxx device families available in 48L TSOP (12x20mm) package.Pre Change:Assembled at LPI using 8340 die attach material and lead frame with paddle size 207x142mils, 183x161mils or 160x130mils.Post Change:Assembled at SIGN using AP-4300 die attach material and lead frame with paddle size 209x165mils or 159x165milsImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying SIGN as a new assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:October 31, 2021 (date code: 2145)
Revision History:February 23, 2021: Issued initial notification.April 14, 2021: Re-issued initial notification to change die attach material to AP-4300 in pre and post change and qual plan.Description of Change:Qualification of SIGN as a new assembly site for selected SST39LFxx and SST39VFxx device families available in 48L TSOP (12x20mm) package.Reason for Change:To improve on-time delivery performance by qualifying SIGN as a new assembly site.Estimated Qualification Completion Date: August 2021
Description of Change:Qualification of SIGN as a new assembly site for selected SST39LFxx and SST39VFxx device families available in 48L TSOP (12x20mm) package.Pre Change:Assembled at LPI using lead frame with paddle size 207x142mils, 183x161mils or 160x130mils.Post Change:Assembled at SIGN using lead frame with paddle size 209x165mils or 159x165milsReason for Change:To improve on-time delivery performance by qualifying SIGN as a new assembly site.Estimated Qualification Completion Date:August 2021
Part Status:
Microchip SST39VF400A-70-4C-EKE - Technical Attributes
| Memory Density: | 4Mb |
| Memory Organization: | 256 K x 16 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Package Style: | TSOP-48 |
| Mounting Method: | Surface Mount |
$Features & Applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST39VF400A-70-4C-EKE is a part of SST39VF Series Multi-Purpose Flash Plus. It has an standard operating temperature ranging from -40°C to +85°C, it comes in TSOP-48 package.
Features:
- Organized as 256K x16
- Single Voltage Read and Write Operations: 2.7-3.6 V
- Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
- Low Power Consumption (typical values at 14 MHz)
- Active Current: 9 mA (typical)
- Standby Current: 3 μA (typical)
- Sector-Erase Capability
- Uniform 2 KWord sectors
- Block-Erase Capability
- Uniform 32 KWord blocks
- Fast Read Access Time: 70 ns
- Latched Address and Data
- Automatic Write Timing
- Internal VPP Generation
- End-of-Write Detection
- Toggle Bit
- Data# Polling
- CMOS I/O Compatibility
- JEDEC Standard
- Flash EEPROM Pinouts and command sets
- All non-Pb (lead-free) devices are RoHS compliant
Available Packaging
Package Qty:
96 per Tray
Package Style:
TSOP-48
Mounting Method:
Surface Mount