Manufacturer Part #
DSPIC33CH512MP205-E/PT
dsPIC33CH Series 64 kB RAM 584 kB Flash 16-Bit Digital Signal Controller-TQFP-48
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:250 per Tray Package Style:TQFP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the dsPIC33CH512MP508 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: 1) Added silicon issue 21 (I2C).Reason for Change: To Improve Productivity Date Document Changes Effective: 12 Feb 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
ERRATA - dsPIC33CH512MP508 Family Silicon Errata and Data Sheet Clarification Notification Status: FinalDescription of Change: Updated device data sheet reference to the current revision D.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Sep 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Final Notice: Qualification of MTAI as an additional assembly site for selected products of the 90nm TSMC wafer technology available in 48L TQFP (7x7x1mm) package using gold (Au) bond wirePre Change: Assembled at ANAP assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3230 die attach, G631HQ molding compound and C194 lead frame material.Post Change:Assembled at ANAP assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3230 die attach, G631HQ molding compound and C194 lead frame material or assembled at MTAI assembly site using gold (Au) bond wire, 3280 die attach, G700HA molding compound and C7025 lead frame material.Reason for Change:To improve manufacturability by qualifying MTAI as an additional assembly sitePlease be advised that after the estimated first ship date customers may receive pre and post change parts.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Package Style: | TQFP-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-48
Mounting Method:
Surface Mount
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