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Manufacturer Part #
DSPIC33CK256MP206-E/PT
IC MCU 16BIT 256KB FLASH 64TQFP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray | ||||||||||
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Microchip DSPIC33CK256MP206-E/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Document for the dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification of devices. Rev Q Document (4/2025)Added silicon revision B5.Added silicon issue 31 (Reset).Reason for Change: To Improve Productivity.Date Document Changes Effective: 30 Apr 2025
Description of Change:Added data sheet clarifications 4 (Pin Diagrams), 5 (High-Speed, 12-Bit Analog-to-Digital Converter (ADC)), 6 (High-Speed Analog Comparator With Slope Compensation DAC), 7 (Oscillator with High-Frequency PLL), 8 (Power-Saving Features), 9 (Controller Area Network (CAN FD) Module), 10 (Inter-Integrated Circuit (I2C)), 11 (Electrical Characteristics) and 12 (Product Identification System).
Microchip has released a new Errata for the dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Added data sheet clarification 3 (Electrical Characteristics).Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Jan 2023
Microchip has released a new Product Documents for the dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change:1. Updated the work around information for silicon issues 2 (I2C) and 3 (I2C).2. Added data sheet clarifications 2 (Electrical Characteristics), 3 (Inter-Integrated Circuit (I2C)),4 (Instruction Set Summary), 5 (High-Speed, 12-Bit Analog-to-Digital Converter (ADC)) and 6 (Special Features). The I2C standard uses the terminology ?Master? and ?Slave?. The equivalent Microchip terminology used in this document is ?Host? and ?Client?, respectively.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 07 March 2022
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Package Qty:
160 per Tray