Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
PIC24HJ12GP202-I/SS
12KB, FLASH, 1024BYTES-RAM, 40MIPS, 21I/O, 16-BIT FAMILY,NANOWATT
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:47 per Tube Package Style:SSOP-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC24HJ12GP202-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24HJ12GP202-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24hj12gp202-i-ss-microchip-3007569
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24HJ12GP202-I/SS&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24hj12gp202-i-ss-microchip-3007569
Microchip PIC24HJ12GP202-I/SS - Technical Attributes
| Family Name: | PIC24H |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 12kB |
| RAM Size: | 1kB |
| Speed: | 40MHz |
| No of I/O Lines: | 21 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx10-bit / 10-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-18 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC24HJ12GP202-I/SS is a 12 kB flash and 1 kB RAM with advanced analog 16-bit microcontroller. It has seamless migration options to PIC24F MCUs, dsPIC33F and dsPIC30F DSCs in similar packages.
Features:
- High-Performance DSC CPU:
- Modified Harvard architecture
- C compiler optimized instruction set
- 16-bit wide data path
- 24-bit wide instructions
- On-Chip Flash and SRAM:
- Flash program memory, up to 12 Kbytes
- Data SRAM, up to 1024 bytes
- Boot and General Security for Program Flash
- Digital I/O:
- Peripheral Pin Select Functionality
- Up to 21 programmable digital I/O pins
- Wake-up/Interrupt-on-Change for up to 21 pins
- System Management:
- Flexible clock options
- Power-up Timer
- Oscillator Start-up Timer/Stabilizer
- Power Management:
- On-chip 2.5V voltage regulator
- Switch between clock sources in real time
- Idle, Sleep and Doze modes with fast wake-up
- Timers/Capture/Compare:
- Timer/Counters, up to three 16-bit timers
- Input Capture (up to 4 channels)
- Output Compare (up to 2 channels)
- Communication Modules:
- 4-wire SPI
- I2C™
- UART
- Analog-to-Digital Converters (ADCs):
- 10-bit, 1.1 Msps or 12-bit, 500 Ksps conversion
- Low-power, high-speed Flash technology
- Fully static design
- Packaging:
- 28-pin SDIP/SOIC/QFN
Available Packaging
Package Qty:
47 per Tube
Package Style:
SSOP-18
Mounting Method:
Surface Mount