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Manufacturer Part #
ATSAMC21G18A-ANT
IC MCU 32BIT 256KB FLASH 48TQFP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip ATSAMC21G18A-ANT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the SAM C20/C21 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:The following Silicon Issues were added in this revision:• ADC: 1.4.10 Syncbusy Enable• Device: 1.8.15 One-Time Programmable LockThroughout the document, updates were performed to add Silicon Revision H.Impacts to Data Sheet: NoneChange Implementation Status: CompleteEstimated First Ship Date: 07 July 2025
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
PCN Status:Final NotificationDescription of Change:Qualification of MTAI as an additional final test site for selected ATSAMC21G18A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, and ATSAMC21G15A device families available in 48L TQFP (7x7x1mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status:In Progress
PCN Status:Final NotificationDescription of Change:Qualification of MTAI as an additional final test site for selected ATSAMC21G18A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, and ATSAMC21G15A device families available in 48L TQFP (7x7x1mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test site for selected ATSAMC21G18A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, and ATSAMC21G15A device families available in 48L TQFP (7x7x1mm) package.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional final test site.
Revision History:November 9, 2020: Issued final notification.December 1, 2020: Re-issued final notification. Corrected the typo error in the date code of the Estimated First Ship Date.December 3, 2020: Re-issued final notification. Removed ATSAMC21J17A-AZ510, ATSAMC21J18A-AZ510, ATSAMC21J17A-AZT510 &ATSAMC21J18A-AZT510 CPNs as they are no longer affected by the change proposed in this PCN.Description of Change:Qualification of UMC Fab 8N as an additional fabrication site for various Atmel catalog part numbers.Reason for Change:Due to unforeseen business conditions, UMC Fab 8N has been qualified as an additional fabrication site effective immediately.January 11, 2024: Re-issued final notification to attached Qualification Report. Update affected CPN list, added new CPNs recently released.
Part Status:
Available Packaging
Package Qty:
2500 per Reel