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Manufacturer Part #
ATSAMD21G17L-MUT
IC MCU 32BIT 128KB FLASH 48QFN
Microchip ATSAMD21G17L-MUT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: June 2025
Description of Change: Qualification of UMC Fab 8S (U08S) an additional fabrication site for selected ATSAMD21E17, ATSAMD21E17LATSAMD21G17, ATSAMD21G17L, ATSAMD21J17, ATSAMD21J17D, PD39210, PD69210, PD69220 and PD77020 device families available in various packages.Reason for Change: To improve productivity and on-time delivery performance by qualifying UMC Fab 8S (U08S) as an additional fabrication site.
Description of Change:The following updates were performed in this revision:? Updated the document throughout to reflect new silicon revisions H, I, and J? Removed obsolete Data Sheet Clarifications? Added errata Device: 1.5.9 One-Time Programmable LockPlease be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
***FPCN104919 Update ***Revision History:April 16, 2024: Issued final notification.May 08, 2024: Re-issued final notification. Updated pre and post change summary table to include package type and package width.Description of Change:Implement new carrier tape leader and trailer length for various packages shipped from MPHL site.Reason for Change:To improve manufacturability by standardizing the carrier tape and trailer length for various packages shipped from MPHL site.
PCN Status:Final NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 2023
Notification Status: FinalDescription of Change:The following errata were added:? SERCOM: 1.15.15 USART in Auto-Baud Mode? TC: 1.17.3 DMA TriggerImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Microchip has released a new Product Documents for the SAM D21/DA1 Family Data Sheet of devices.Notification Status: FinalDescription of Change: SYSCTRL- Removed erroneous text from the DFLLRDY bitfield of the PCLKSR Register.DMAC- Removed non-applicable text from Burst Transfer in DMA. TCC- Updated the number of TCC Instances in Overview.ADC- Updated the Equations in Prescaler for Single-Shot and Free-Running Modes.AC- Added a new paragraph to Overview for L-Variant devices.DAC- Updated Synchronization to reflect that no bits need synchronization.Electrical Characteristics at 85?C? Updated the POR Operating Principle figure to properly reflect an Internal RESET in Power-On-Reset (POR) Characteristics? Updated the following figures in BOD33 to properly display the Internal RESET: ? BOD33 Hysteresis OFF ? BOD33 Hysteresis ON ? Removed erroneous SS line from the SPI Timing Requirements in Host Mode figure in SERCOM in SPI Mode Timing SAM DA1 Electrical Characteristics at 105?C- Updated the values in the BOD33 LEVEL Value table in BOD33. Appendix B- Updated Ordering Information with a new table reflecting all ISELED parts. Packaging Information- Updated the following packages with a new note: ? 64-Pin VQFN ? 48-Pin VQFN - Added the following package: ? 64-Lead VQFN 4Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 10 Sept 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the SAM D21 / DA1 Family Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: The following updates were performed in this revision:? Added new notes to the SAM D21 Family Silicon Device Identification table? Added a new Data Sheet Clarification for BOD33? Added the following silicon errata issue:? BOD33: 1.21.1 HysteresisImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Aug 2021
Part Status:
Microchip ATSAMD21G17L-MUT - Technical Attributes
| Family Name: | QFN-48 |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 48MHz |
| No of I/O Lines: | 38 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART |
| Peripherals: | Brownout Reset/Brown-out Detect/DMA/I2S/POR |
| Supply Voltage: | 1.62V to 3.63V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 14-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | QFN-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per
Package Style:
QFN-48
Mounting Method:
Surface Mount
