Free shipping within the continental US over $50. Conditions apply
Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Manufacturer Part #
ATSAME54N20A-AU
SAMD54 Series 1 MB Flash 256 kB RAM 120 MHz 32-Bit Microcontroller - TQFP-100
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2342 | ||||||||||
Microchip ATSAME54N20A-AU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Datasheet for the SAM D5x/E5x Family Data Sheet of devices.Notification Status: FinalDescription of Change:Section Name or TypeChange DescriptionFeatures? Added content for Related Devices to the Features setImpacts to Data Sheet: NoneReason for Change: To Improve Productivity Change Implementation Status: CompleteDate Document Changes Effective: 10 Dec 2024
Description of Change:Qualification of MMT as an additional assembly site for selected ATSAME5xxx, ATSAMD5xxx and PIC32CX1025SG41100xxx device families available in 100L TQFP (14x14x1mm) package.Pre and Post Change Summary: See attached documentImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:May 24, 2024 (date code: 2421)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached document
Microchip has released a new Errata for the SAM D5x/E5x Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: The following errata were added in this revision:? Device: 2.6.10 Power UpImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 01 Mar 2023
Microchip has released a new Errata for the SAM D5x/E5x Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: The following errata were added in this revision:? SERCOM: 2.18.26 SERCOM-USART LIN Host Delays? SERCOM: 2.18.27 SERCOM-USART Two Stop Bits in LIN Host The following errata were updated with new verbiage in this revision:? Device: Detection of a Debugger Probe 2.6.3? SUPC: Buck Converter Mode 2.19.1Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 12 Dec 2022
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATSAME54N20A-AU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--32-bit/atsame54n20a-au-microchip-5096614
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATSAME54N20A-AU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--32-bit/atsame54n20a-au-microchip-5096614
Microchip ATSAME54N20A-AU - Technical Attributes
| Family Name: | SAME54 |
| Core Processor: | ARM Cortex M4F |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 1MB |
| RAM Size: | 256kB |
| Speed: | 120MHz |
| No of I/O Lines: | 81 |
| InterfaceType / Connectivity: | CAN/EBI/EMI/Ethernet/IrDA/I2C/LIN/MMC/QSPI/SD/SPI/UART/USART/USB |
| Peripherals: | Brown-out Detect/DMA/I2S/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.71V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 28-chx12-bit |
| On-Chip DAC: | 2-chx12-bit |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount