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Manufacturer Part #
PIC32MX470F512L-I/PT
PIC32MX Series 512 kB Flash 128 kB RAM 80 MHz 32-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:119 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2509 | ||||||||||
Microchip PIC32MX470F512L-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Microchip has released a new Errata for the PIC32MX330/350/370/430/450/470 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:The following updates were performed in this revision.? The note was clarified in silicon issue 11. Module: ?USB?? Added silicon issue 26. Module: ?Flash: RTSP?Reason for Change: To Improve Productivity
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
ERRATA - PIC32MX330/350/370/430/450/470 Family Silicon Errata and Data Sheet Clarification Silicon Die Revision Addition and Errata Document RevisionDescription of Change: 1) The document was updated for silicon revision B0 devices. 2) 128 KB devices were moved from Table 1 to Table 2 3) Added separate 128 KB row to Affected Silicon Revisions tables 4) Added silicon issues 15 (UART), 16 (UART), 17 (CTMU), 18 (ADC), 19 (HVD), and 20 (Power-Saving Modes), 21 (Flash Memory), and 23 (Flash Memory) 5) Deleted silicon issue 3 (CTMU)
Part Status:
Microchip PIC32MX470F512L-I/PT - Technical Attributes
| Family Name: | PIC32MX |
| Core Processor: | MIPS32 M4K |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 512kB |
| RAM Size: | 128kB |
| Speed: | 80MHz |
| No of I/O Lines: | 83 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/PMP/SPI/UART/USART/USB OTG |
| Peripherals: | Brown-out Detect/DMA/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2.3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 28-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
119 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount