
Référence fabricant
PIC32MX575F512L-80I/PT
PIC32MX Series 512 kB Flash 64 kB RAM SMT 32-Bit Microcontroller - TQFP-100
Microchip PIC32MX575F512L-80I/PT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip PIC32MX575F512L-80I/PT - Caractéristiques techniques
Family Name: | PIC32MX |
Core Processor: | MIPS32 M4K |
Program Memory Type: | Flash |
Flash Size (Bytes): | 512kB |
RAM Size: | 64kB |
Speed: | 80MHz |
No of I/O Lines: | 85 |
InterfaceType / Connectivity: | CAN/I2C/SPI/UART/USB |
Peripherals: | Analog Comparators/CAN/I2C/On-Chip-ADC/PWM/SPI/UART/USB/Watchdog |
Number Of Timers: | 5 |
Supply Voltage: | 2.3V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 16-chx10-bit |
Watchdog Timers: | 1 |
Style d'emballage : | TQFP-100 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
119 par Tray
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount