
Référence fabricant
R7FA6M3AF3CFC#AA0
RA6M3 Series 1 MB Flash 140 kB RAM 120 MHz SMT 32-Bit Microcontroller-LQFP-176
Renesas R7FA6M3AF3CFC#AA0 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
This notification announces a change to the assembly and final test sites for select RA (RA6M3) & SYNERGY (S5D9) devices in the 176pin LFQFP package. As a result of the site changes, some assembly materials are also changing. There is a change to the part number, fit and form. There is no impact to the specifications, characteristics, quality & reliability of the products.
Statut du produit:
Renesas R7FA6M3AF3CFC#AA0 - Caractéristiques techniques
Family Name: | RA6M3 |
Core Processor: | ARM Cortex M4 |
Program Memory Type: | Flash |
Flash Size (Bytes): | 1MB |
RAM Size: | 140kB |
Speed: | 120MHz |
No of I/O Lines: | 133 |
InterfaceType / Connectivity: | I2C/SPI/UART/USART |
Peripherals: | Watchdog |
Number Of Timers: | 16 |
Supply Voltage: | 2.7V to 3.6V |
Operating Temperature: | -40°C to +105°C |
Style d'emballage : | LQFP-176 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
40 par Tray
Style d'emballage :
LQFP-176
Méthode de montage :
Surface Mount