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Manufacturer Part #
AT89S51-24JU
Download the CAD models for this product. Learn more about SnapMagic.
27 per Tube
PLCC-44
Surface Mount
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Description of Change: Qualification of 3280NP as an additional die attach material for selected PIC16Cxx, PIC17Cxx, PIC18Fxx, PIC18Cxx, A40MX0xx, AT89C5xx, TC7117xx, TC7106xx, TC7107xx, TC850xx, TC7116xx, TC7109xx, PIC16Fxx, AY0438xx, HV518xx, HV5222xx, HV5308xx, HV9308xx, HV9408xx, HV5408xx, TC7129xx, MM5450xx, MM5451xx, ATF150xx, AT80C5xx, AT89LPxx, AT89S5xx, AT89LSxx, AT89S8xx, ATF250xx, AT27BVxx, AT27C2xx, MT8812xx, MT8816xx, MT093xx, HV5122xx, AT27C1xx, AT27C4xx, HV5622xx, HV5630xx, LE58QLxx, ATmega8515, ATF16Lxx, AT17LVxx, ATF16Vxx, TC1443xx, HV5812xx, HV2022xx, HV2301xx, HV2201xx, HV219xx, ATF22Vxx, ATF750xx, MIC58Pxx, MIC59Pxx, MIC580xx, ATF22Lxx, SY100Exx, MT8952xx, MT9171xx, MT9172xx, MT9122xx, MT8808xx, MT8806xx, COM200xx, A42MX2xx, A42MX0xx, A42MX1xx, AT27C0xx, AT27LVxx, AT28C0xx, AT28LVxx, AT28HCxx, AT28C2xx, AT28BVxx, AT28C6xx, AT27C5xx, SST39Sxx, SST39Lxx, SST39Vxx, SST49Lxx and LE79R7xx device families available in various packages.Reason for Change: To improve manufacturability by qualifying 3280NP as an additional die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
***UPDATE OF PCN112896***Revision History: April 28, 2025: Issued initial notification. February 02, 2026: Issued final notification. Attached the Qualification Report. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on April 01, 2026.Product Category: 8-Bit MicrocontrollersDescription of Change: Qualification of MTAI as a new final test site for AT89C51RC-24JU, AT89C55WD-24JU, AT89C55WD-24JUR, AT89LP52-20JU, AT89LP52QS840-20JUR840, AT89LS52-16JU, AT89S51-24JU, AT89S51-24JUR, AT89S52-24JU, AT89S52-24JUR, AT89S8253-24JU and AT89S8253-24JUR catalog part numbers (CPN) available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as a new final test site.Estimated First Ship Date: 01 April 2026 (date code: 2614)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of MTAI as a new final test site for AT89C51RC-24JU, AT89C55WD-24JU, AT89C55WD-24JUR, AT89LP52-20JU, AT89LP52QS840-20JUR840, AT89LS52-16JU, AT89S51-24JU, AT89S51-24JUR, AT89S52-24JU, AT89S52-24JUR, AT89S8253-24JU and AT89S8253-24JUR catalog part numbers (CPN) available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as a new final test site.
**FPCN106608 UPDATE **Revision History:April 22, 2024: Issued initial notification.June 25, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 5, 2024.Description of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.
Description of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MPHL as a new final test location for selected AT89C51RC, AT89C55WD, AT89LP51ED2, AT89LP51RB2, AT89LP51RC2, AT89LP51RD2, AT89LP52, AT89LP52QS840, AT89LS52, AT89S51, AT89S52, AT89S8253 and ATmega8515 device families available in 44L PLCC (16.6x16.6x4.4mm) package.Reason for Change:To improve manufacturability by qualifying MPHL as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2024
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