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Manufacturer Part #
ATMEGA1280V-8AU
ATmega Series 128 KB Flash 8 KB SRAM 8 MHz 16 MHz 8-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATMEGA1280V-8AU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
**FPCN102817 UPDATE**Revision History:January 03, 2024: Issued initial notification.June 24, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 19, 2024.Description of Change:Qualification of MTAI as a new final test site for selected ATMEGA6450, ATMEGA6490, ATMEGA640, ATMEGA2560, ATMEGA3250, ATMEGA3290 and ATMEGA1280 device families available in 100L TQFP (14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test site.
***June 12, 2024: Issued cancellation notification***Description of Change:This qualification was originally performed to qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.Reason for Change:Microchip has decided to not qualify TMGR as an additional fabrication site for selected Atmel ATMEGA64xx, ATMEGA12xx, ATMEGA25xx and ATTINY25xx device families available in various packages.
Revision History:July 27, 2023: Issued initial notification.February 05, 2024: Updated affected parts list to remove CPN ATMEGA64L-8AQRA1 due to already EOL; Issued cancellation notification.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected AT90CANxx, AT90USBxx and ATMEGAxx device families available in 64L and 100L TQFP (14x14x1mm) packages at MMT assembly site.
Description of Change: Qualification of MTAI as a new final test site for selected ATMEGA6450, ATMEGA6490, ATMEGA640, ATMEGA2560, ATMEGA3250, ATMEGA3290 and ATMEGA1280 device families available in 100L TQFP (14x14x1mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATMEGA1280V-8AU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/atmega1280v-8au-microchip-1082328
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATMEGA1280V-8AU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/atmega1280v-8au-microchip-1082328
Microchip ATMEGA1280V-8AU - Technical Attributes
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 8kB |
| Speed: | 8MHz |
| No of I/O Lines: | 86 |
| InterfaceType / Connectivity: | EBI/EMI/I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount