

Manufacturer Part #
ATMEGA329PA-MUR
20MHZ, QFN/MLF, IND TEMP, GREEN, T&R
Microchip ATMEGA329PA-MUR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:September 27, 2023: Issued initial notification.June 24, 2024: Issued cancellation notification.PCN Status:Cancellation NotificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx, ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
Description of Change: Qualification of ASEM as an additional assembly site for selected ATMEGA128x, ATMEGA165xx, ATMEGA169xx, ATMEGA64x, ATMEGA645xx, ATMEGA649xx, ATMEGA329xx, and ATMEGA325xx device families available in 64L VQFN (9x9x1mm) package.Reason for Change: To improve on-time delivery performance by qualifying ASEM as an additional assembly site.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected AT42QT1xx, AT90PWM81xx, ATMEGA128xx, ATMEGA16xx,ATMEGA32xx, ATMEGA64xx, ATMEGA8xx and ATTINYxx device families available in various packages.Reason for Change:To improve on-time delivery performance byqualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site.
Microchip has released a new Product Documents for the ATmega169A/PA/329A/PA/3290A/PA/649A/P/6490A/P Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: Initial document release. ? Content moved from the data sheet and restructured to the new document template ? Updated the die revision list to reflect die revisions in productionData Sheet Clarifications added: ? Errata section in data sheet is no longer valid ? 3.2. Power Management and Sleep Modes ? Electrical Characteristics ? TA = -40?C to 85?C ? 3.3.1. Analog Input Offset Voltage (TA = -40?C to 85?C) ? 3.3.2. Power-Down Specification Limit (TA = -40?C to 85?C) ? Electrical Characteristics ? TA = -40?C to 105?C ? 3.4.1. Analog Input Offset Voltage (TA = -40?C to 105?C) ? 3.4.2. Power-Down Specification Limit (TA = -40?C to 105?C)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 March 2022
PCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch waferImpacts to Data Sheet:None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Due to unforeseen circumstances, that are out of Microchip?s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new fabrication site as soon as possible as to not disrupt customer orders. Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch wafer Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Due to unforeseen business conditions, Microchip Technology Tempe Fab 2 (TMGR) has been qualified as a additional fabrication site effective immediately. Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
4000 per Std. Mfr. Pkg