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Manufacturer Part #
PIC10F200T-I/OT
PIC10F Series 384 B Flash 16 B RAM SMT 8-Bit Microcontroller - SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2512 | ||||||||||
Microchip PIC10F200T-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
***UPDATE OF PCN109250 & PCN111719***Description of Change: Qualification of CuPdAu as a new wire material and 8006NS as a new die attach material for selected 24AA014, 24AA025xxx, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A, 25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.Estimated First Ship Date: 11 April 2025 (date code: 2515)
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC10F200T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/pic10f200t-i-ot-microchip-4092128
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC10F200T-I/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/pic10f200t-i-ot-microchip-4092128
Microchip PIC10F200T-I/OT - Technical Attributes
| Family Name: | PIC10F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 384B |
| RAM Size: | 16B |
| Speed: | 4MHz |
| No of I/O Lines: | 3 |
| Peripherals: | POR/Watchdog |
| Number Of Timers: | 1 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| Watchdog Timers: | 1 |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC10F200 is a low-cost, high-performance, 8-bit, fullystatic, Flash-based CMOS microcontroller. It employs a RISC architecture with only 33 single-word/ single-cycle instructions. All instructions are single cycle (1 μs) except for program branches, which take two cycles. It delivers performance in an order of magnitude higher than competitors in the same price category. The easy-to-use and easy to remember instruction set reduces development time significantly.
PIC10F200T-I/OT is part of the PIC10F Series family with a 8-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40 to 125 and has 6 pin in SOT package. This device is lead free.
Features:
- Available in either SOT-23 or 2x3 DFN packaging.
- Precision 4 MHz internal oscillator.
- Baseline Core with 33 Instructions, 2 Stack Levels.
- All single-cycle Instructions.
- except for program branches which are two cycles.
- 12-bit wide instructions 8-bit wide data path.
- 25 mA source/sink current I/O.
- Low power (100nA) sleep current.
- One 8-bit timer (TMR0).
- Watchdog timer (WDT).
- In Circuit Serial Programming™ (ICSP™) capability.
- In-Circuit debugging support.
- Programmable code protection.
Available Packaging
Package Qty:
3000 per
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount
