Manufacturer Part #
PIC12F683T-I/SN
PIC12F Series 3.5 kB Flash 128 B SRAM SMT 8-Bit Microcontroller - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2327 | ||||||||||
Microchip PIC12F683T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Revision History:February 9, 2021: Issued final notification. Provided estimated first ship date to be February 19, 2021.March 22, 2021: Re-issued final notification. Attached the qualification report.Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designChange Implementation Status:In ProgressEstimated First Ship Date:February 19, 2021 (date code: 2108)
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designEstimated First Ship Date: February 19, 2021 (date code: 2108)
Part Status:
Microchip PIC12F683T-I/SN - Technical Attributes
| Family Name: | PIC12F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128B |
| Speed: | 20MHz |
| No of I/O Lines: | 6 |
| Peripherals: | Analog Comparators/On-Chip-ADC/PWM/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 4-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers. The 8-bit PIC® microcontroller solutions feature a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, comprehensive application notes, complete technical documentation and post design-in support through a worldwide sales and distribution network. Microchip is committed to easy migration across product families, providing seamless program memory expansion, pin compatibility, and a unified development environment for all products.
The Low Pin-count (8) PIC® Flash microcontroller products offer all of the advantages of the well recognized mid-range x14 architecture with standardized features including a wide operating voltage of 2.0-5.5 volts, on-board EEPROM Data Memory, and nanoWatt Technology. Standard analog peripherals include up to 4 channels of 10-bit A/D, an analog comparator module with a single comparator, programmable on-chip voltage reference and a Standard Capture/Compare/PWM (CCP) module.
PIC12F683T-I/SN is part of the PIC12F Series family with a 8-Bit Microcontroller.It can sustain standard temperature ranges from -40°C to +125°C and has 8 pin in SOIC package. This device is lead free.
Features:
- 256 bytes of EEPROM data memory
- Extended WDT
- MPLAB® ICD-2 programming support or debugging support with optional header adapter
- Precision internal oscillator – software selectable 8 MHz – 32 KHz
- nanoWatt Technology
- Software selectable BOR
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount