
Manufacturer Part #
PIC16F13145-I/SS
PIC16F Series 14 KB Flash 1 KB RAM 32 MHz Microcontroller IC 8-Bit - SSOP-20
Microchip PIC16F13145-I/SS - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the PIC16F13145 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Update to errata item 1.3.1.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity. Change Implementation Status: CompleteDate Document Changes Effective: 22 Jul 2024
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Microchip PIC16F13145-I/SS - Technical Attributes
Family Name: | PIC16F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 14kB |
RAM Size: | 1024B |
Speed: | 32MHz |
No of I/O Lines: | 17 |
InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
Peripherals: | Brownout Reset/Brown-out Detect/POR/PWM |
Supply Voltage: | 1.8V to 5.5V |
Operating Temperature: | -40°C to +85°C |
Package Style: | SSOP-20 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
67 per Tube
Package Style:
SSOP-20
Mounting Method:
Surface Mount