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Manufacturer Part #
PIC16F819-E/ML
PIC16F Series 3.5 kB Flash 256 B RAM 20 MHz 8-Bit Microcontroller - QFN-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F819-E/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
****FPCN109138 UPDATE****Description of Change: Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x andPIC16F9x device families available in 28L VQFN (6x6x1.0 mm) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to FPCN109053 **Revision History:Re-issued initial notification. Updated the qualification plan to include the High Temperature Storage Life (HTSL) test.Description of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
PCN Status:Initial NotificationDescription of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip PIC16F819-E/ML - Technical Attributes
| Family Name: | PIC16 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 256B |
| Speed: | 20MHz |
| No of I/O Lines: | 16 |
| InterfaceType / Connectivity: | I2C/SPI |
| Peripherals: | I2C/On-Chip-ADC/PWM/SPI/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 4V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 5-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount