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Manufacturer Part #
PIC16LF15354-I/SS
8-bit Microcontrollers - MCU 7KB, 512B RAM, 4xPWMs, Comparator, DAC, ADC, CWG, 4
Microchip PIC16LF15354-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Errata for the PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification.ERRATA - PIC16(L)F15354/55 Family Silicon Errata and Data Sheet ClarificationNotification Status: FinalDescription of Change: Updated data sheet revision letterImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Datasheet for the PIC16(L)F15354/55 Full-Featured 28-Pin Microcontrollers of devices. If you are using one of these devices please read the document located at PIC16(L)F15354/55 Full-Featured 28-Pin Microcontrollers.Data Sheet - PIC16(L)F15354/55 Full-Featured 28-Pin MicrocontrollersNotification Status: FinalDescription of Change: Updated Table 3; Registers 14-3, 14-27, and 20-1Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 25 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Product Documents for the PIC16(L)F15313/23 Full-Featured 8/14-Pin Microcontroller Data Sheet of devices.Notification Status: FinalDescription of Change: 1) Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?2) Replaced ADCRC appearances with FRC.3) Updated Figures 30-1, 30-2, 30-3 and 30-4: CWGxISM replaced with CWG1DAT. Updated Section 1, Tables 4-10, 29-2, 31-2, 31-4, 36-3 and 37-6, and Figures 37-5, 37-9, 37-10, 38-14 and 38-15.4) Minor package corrections.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 16 Feb 2022
Microchip has released a new Product Documents for the PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: 1) Added Silicon Revision A4Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 28 Dec 2021
Description of Change:1. Updated terminology used throughout the data sheet: ?master? replaced by ?host?, and ?slave? replaced by ?client?. Replaced ADCRC appearances with FRC.2. Updated package information to include QFN and VQFN (6x6mm) packaging replaces PDIP with SPDIP packaging.3. Updated figures 30-1, 30-2, 30-3 and 30-4. CWGxISM replaced with CWG1DAT. Updated Tables 4-10, 29-2, 31-2, 31-4,36-3 and 37-6, and Figures 37-5, 37-9 and 37-10.Reason for Change: To Improve Productivity
Part Status:
Available Packaging
Package Qty:
47 per Std. Mfr. Pkg