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Manufacturer Part #
PIC18F46K40-I/PT
PIC18F46 Series 8-Bit 64MHz 64KB Flash Microcontroller IC TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray | ||||||||||
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Microchip PIC18F46K40-I/PT - Product Specification
Shipping Information:
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PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F1537x, PIC16F1887x, PIC16F1917x, PIC16F1919x, PIC18F44Q71, PIC18F45K4x, PIC18F45Qxx, PIC18F46K4x, PIC18F46Qxx, PIC18F47K4x, PIC18F47Qxx, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in 44L and 64L TQFP (10x10x1mm) packages.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material.Estimated First Ship Date: 30 May 2025 (date code: 2522)
Microchip has released a new Datasheet for the PIC18(L)F26/45/46K40 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology Data Sheet of devices. Notification Status: FinalDescription of Change:Updated reset values for IPR0, IPR3, TMR0H and BAUDxCON.Added data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Microchip has released a new Document for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:Updated document format to most current version; silicon issues are renumbered accordingly.Added silicon issue 1.7.2 (TMR0H Register Does Not Increment).Updated data sheet revision level and removed existing data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: None.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Microchip has released a new Errata for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Update PFM back-to-back workaround. Move software breakpoints to PIC18 Debug Executive.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Microchip has released a new Errata for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:1. Added silicon errata 2.1.7, 2.1.8, 2.4.2, 2.10.1, 2.11.1.2. Re-write2.7.1.3. Remove Data Sheet Clarification for Operating speed.4. Modified 3.2.1 (Electrical Specification) ADC Offset Error updated to -+3.0LSb.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 22 Jun 2022
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
Part Status:
Available Packaging
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160 per Tray