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Manufacturer Part #
PIC18F46K42T-I/ML
64KB Flash, 4KB RAM, 1KB EEPROM, 12-bit ADC2, Vector Interrupts, DMA, MAP, DIA,
Microchip PIC18F46K42T-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F15344, PIC16F1535x, PIC16F1537x, PIC16F18346, PIC16F1885x, PIC16F1887x, PIC16F1919x, PIC18F24K4x, PIC18F25K4x, PIC18F25K83, PIC18F26K4x, PIC18F26K83, PIC18F27K4x, PIC18F45K4x, PIC18F46K4x, PIC18F47K4x, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in various packages assembled at MTAI.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and QMI519 as a new die attach material assembled at MTAI.Estimated First Ship Date: 05 August 2025 (date code: 2532)
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devices. Description of Change: 1) Added Module 11.1 Software Breakpoints. Minor corrections.Reason for Change: To Improve Productivity Date Document Changes Effective: 03 March 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the PIC18(L)F26/27/45/46/47/55/56/57K42 Data Sheet of devices. Description of Change:1) Added 48-Lead VQFN package marking and details; updated CLKOUT specifications (Figure 44-5).2) Other minor corrections.Reason for Change: To Improve Manufacturability Date Document Changes Effective: 03 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
1600 per Std. Mfr. Pkg