Manufacturer Part #
SmartFusion; 484 FBGA 27x27
Description of Change:Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products.Pre Change: Using Microsemi�s packing processPost Change:Using Microchip�s packing processPre and Post Change Summary:NOTE: See attached Packing Pre and Post Changes for the changes Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated Implementation Date: February 15, 2021 (date code: 2108)Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions.Time Table Summary: see attachedRevision History:January 18, 2021: Issued final notification. Provided estimated first ship date to be on February 15, 2021.The change described in this PCN does not alter Microchip�s current regulatory compliance regarding the material content of the applicable products.