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Manufacturer Part #
ECC204-MAVDA-T
ECC204 Series 5.5 V I2C Interface Cryptographic Authentication IC - UDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:UDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ECC204-MAVDA-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:No changes were made to the actual silicon. Changes are only to the data sheet.1. DC Parameters: All I/O Interfacesi. Added input thresholds when in Sleep mode (VILS, VIHS)ii. Updated the UDFN, SOIC and 3-Lead Contact ?JA values2. Product Identification System: Product identification is now a separate section and not part of Back MatterReason for Change: To Improve Productivity
PCN Status:Initial NotificationDescription of Change:Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site for selected ECC204, ECC206, RNG90, SHA104, SHA105 and SHA106 device families available in 2L VSFN (2x2.35x0.85mm), 3L CONTACT (2.5x6.5x0.5mm) and 8L UDFN (2x3x0.6mm) packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:August 2024
Part Status:
Microchip ECC204-MAVDA-T - Technical Attributes
| Frequency-Max: | 400kHz |
| Supply Voltage: | 1.65V to 5.5V |
| Memory Density: | 512b |
| Program Memory Type: | EEPROM |
| InterfaceType / Connectivity: | I2C |
| Operating Temp Range: | -40°C to +105°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | UDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount
