Manufacturer Part #
SLE66R01LNBX1SA2
Ticketing Wafer Device
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Die Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Infineon SLE66R01LNBX1SA2 - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
Infineon SLE66R01LNBX1SA2 - Technical Attributes
Attributes Table
| Frequency-Max: | 13.56MHz |
| Memory Density: | 512b |
| Program Memory Type: | EEPROM |
| Operating Temp Range: | -25°C to +70°C |
| Storage Temperature Range: | -40°C to +125°C |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
26 Weeks
Quantity
Unit Price
1
$0.0564
400
$0.055
1,250
$0.0533
2,500
$0.0524
7,500+
$0.0495
Product Variant Information section
Available Packaging
Package Qty:
1 per Die
Mounting Method:
Surface Mount