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Manufacturer Part #
IS1870SF-202
Bluetooth. 4.2 Higher Throughput and Higher Security BLE SOC for IoT
Microchip IS1870SF-202 - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Product Documents for the IS1870/71 Data Sheet of devices. Notification Status: FinalDescription of Change: This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 22 Sep 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:August 10, 2020: Issued initial notification.April 14, 2021: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date to be on May 14, 2021.Description of Change: Qualification of MMT as a new assembly site for IS1870SF and IS1871SF device families available in 32L VQFN (4x4x0.9mm) and 48L VQFN (6x6x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site. Estimated First Ship Date:May 14, 2021 (date code: 2120)
Microchip has released a new Product Documents for the IS1870/71 Data Sheet of devices. Notification Status: FinalDescription of Change: This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document.1) 2.2 System Block Specification. Performed following change: - 4-wire master/slave SPI to 4-wire SPI 2) 3.0 Electrical Characteristics. Updated the following values in Table 3-1. - Digital Output Min value from 1387 to 1160 - Digital Output Max value from 2448 to 2649Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 05 Feb 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: Qualification of MMT as a new assembly site for IS1870SF and IS1871SF device families available in32L VQFN (4x4x0.9mm) and 48L VQFN (6x6x0.9mm) packages.Pre Change:Assembled at ASCL using palladium coated copper (PdCu) bond wire and EN-4900 die attach material with MSL-3classification.Post Change:Assembled at MMT using palladium coated copper with gold flash (CuPdAu) bond wire and 3280 die attach material with MSL-1 classification.Reason for Change:To improve on-time delivery performance by qualifying MMT as a new assembly site.Estimated Qualification Completion Date:October 2020
Part Status:
Available Packaging
Package Qty:
5000 per Std. Mfr. Pkg