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Manufacturer Part #
LBEE5QD1ZM-572
1ZM Series Dual Band WiFi 11a/b/g/n/ac and Bluetooth 5.1 Module
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| Mfr. Name: | Murata | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Package Style:Module Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2431 | ||||||||||
Murata LBEE5QD1ZM-572 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=LBEE5QD1ZM-572&field4=Murata&field18=https://p1na.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--wifi-bluetooth/lbee5qd1zm-572-murata-9151250
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=LBEE5QD1ZM-572&field4=Murata&field18=https://p1na.futureelectronics.com/p/semiconductors--wireless-rf--rf-modules-solutions--wifi-bluetooth/lbee5qd1zm-572-murata-9151250
Murata LBEE5QD1ZM-572 - Technical Attributes
| Package Style: | Module |
| Mounting Method: | Surface Mount |
Features & Applications
Type 1ZM
Shielded Ultra Small Dual Band Wi-Fi® 11a/b/g/n/ac + Bluetooth® 5.1 Module
• 2.4 GHz & 5 GHz Wi-Fi® + Bluetooth® Module
• Network Topology: uAP and STA dual mode
• Chipset: NXP (88W8987)
• Processor: No
• FCC/IC "Reference" Certified
• Modulation: DSSS / CCK / OFDM
High-Performance Capabilities for Internet of Things
• For Industrial IoT, Smart Home, Audio/Video/Voice, Gateway
• 802.11 a/b/g/n/ac 1x1 433Mbps
• NXP i.MX Linux, Android, FreeRTOS
Available Packaging
Package Qty:
1000 per
Package Style:
Module
Mounting Method:
Surface Mount
