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Manufacturer Part #
MIC4422AYM
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95 per Tube
SOIC-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for MIC5011YM, MIC2193YM, MIC2193YM-TR, MIC2194YM-TR, MIC2196YM, MIC2196YM-TR, MIC5011YM-TR, MIC5013YM, MIC5013YM-TR, MIC2194YM, MIC2505YM, MIC2505YM-TR, MIC2506YM, MIC2506YM-TR, MIC4422AYM-TR, MIC4422YM, MIC4422YM-TR, MIC4422ZM, MIC4451YM, MIC4452VM, MIC4452VM-TR, SPN040028G, MIC4452YM-TR, MIC4451YM-TR, MIC4452YM, MIC4421ZM, MIC4421ZM-TR, MIC4422ZM-TR, MIC2505-1YM, MIC4421AZM-TR, MIC2505-2YM, MIC2505-2YM-TR, MIC4421YM, MIC4421YM-TR, MIC2505-1YM-TR, MIC4422AZM, MIC4422AZM-TR, MIC4422AYM, MIC4421AZM, MIC4421AYM, MIC4421AYM-TR and MIC4421AXM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package assembled at STAR site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Part Status:
MIC4422AYM and MIC4421A MOSFET drivers are rugged, efficient, and easy to use. The MIC4421A is an inverting driver, while the MIC4422A is a non-inverting driver. Both versions are capable of 9 A (peak) output and can drive the largest MOSFETs with an improved safe operating margin.
The MIC4421A/4422A accepts any logic input from 2.4 V to VS without external speed-up capacitors or resistor networks. Proprietary circuits allow the input to swing negative by as much as 5 V without damaging the part. Additional circuits protect against damage from electrostatic discharge. MIC4421A/4422A drivers can replace three or more discrete components, reducing PCB area requirements, simplifying product design, and reducing assembly cost. Modern Bipolar/CMOS/DMOS construction guarantees freedom from latch-up. The rail-to-rail swing capability of CMOS/DMOS insures adequate gate voltage to the MOSFET during power up/down sequencing. Since these devices are fabricated on a self-aligned process, they have very low crossover current, run cool, use little power, and are easy to drive.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.