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Manufacturer Part #
MIC2104YML-TR
75V DC-DC BUCK CONTROLLER WITH HSC
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-16 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC2104YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Revision History:September 15, 2022: Issued initial notification.May 03, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 25, 2023.Description of Change:Qualification of MTAI as an additional final test site for MIC210xYML device family available in 16L VQFN (3x3x1.00mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifyingMTAI as an additional final test site.
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test site for MIC210xYML device family available in 16L VQFN (3x3x1.00mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test siteReason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status:In ProgressEstimated First Ship Date:August 25, 2023 (date code: 2334)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2104YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--power-controllers--pwm-controllers/mic2104yml-tr-microchip-7034348
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2104YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--power-controllers--pwm-controllers/mic2104yml-tr-microchip-7034348
Microchip MIC2104YML-TR - Technical Attributes
| Supply Current-Max: | 15A |
| Supply Voltage: | 4.5V to 75V |
| Frequency-Max: | 600kHz |
| Input Voltage: | 75V |
| Topology: | Buck |
| Duty Cycle-Max: | 85% |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Output Current: | 10mA |
| Thermal Resistance: | 50.8°C/W |
| Package Style: | MLF-16 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-16
Mounting Method:
Surface Mount