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Manufacturer Part #
MIC2009A-2YM6-TR
ADJUSTABLE CURRENT LIMITING POWER DISTRIBUTION SWITCH
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC2009A-2YM6-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 06, 2022: Issued initial notification.January 23, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 28, 2023.Description of Change:Qualification of G700 as a new mold compound material for selected MIC20xxx and MIC5159 device families available in 6L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 as a new mold compound material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2009A-2YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--power-switches/mic2009a-2ym6-tr-microchip-8005847
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2009A-2YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--power-switches/mic2009a-2ym6-tr-microchip-8005847
Microchip MIC2009A-2YM6-TR - Technical Attributes
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 220mΩ |
| Rated Current-Max: | 0.9A |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount