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Référence fabricant
MCP1827ST-3302E/EB
1.5A CMOS LDO, VOUT=3.3V, EXTENDED TEMP RANGE
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :750 par Reel Style d'emballage :TO-263-4 (DDPAK) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP1827ST-3302E/EB - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 112912 ***Revision History: March 07, 2025: Issued initial notification.March 10, 2025: Re-issued initial notification to update the Qualification Plan file.May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.November 11, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 10, 2025. Updated affected parts list to add MCP1824ST1202E/DBVAO, MCP1824T1802E/OTVAO, MCP1825S-5002E/DBVAO and MCP1725-5002E/SNVAO catalog part numbers (CPN). Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families of 132k and 133k technologies available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 10 December 2025 (date code: 2550)
******FPCN111387 UPDATE/LOCATION CHANGE******Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.**March 10, 2025: Re-issued initial notification to update the Qualification Plan file.**May 14, 2025: Re-issued the initial notification to update the test name from 'Q100' to 'DLT' and to increase the number of lots from '1' to '3' for ELFR, DLT, and Electrical Distribution tests in the Qual Plan.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP3905L, MCP3906A, MCP3905A, MCP3907N, MCP1643, MCP1642, MCP3901, MCP3903, MCP3909, MCP3905, MCP1727, MCP1827S, MCP1725, MCP1827, MCP1825, MCP1826, MCP1824, MCP1825S, MCP1826S, MCP1825-ADJ and MCP1824S device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.
Microchip has released a new Datasheet for the MCP1827/S - 1.5A, Low Voltage, Low Quiescent Current LDO Regulator of devices.Description of Change: Revision E (May 2023) • Added automotive qualification to Features and examples to Product Identification System. • Updated Absolute Maximum Ratings to better describe the part. • Updated Section 6.0, Packaging Information.Reason for Change: To Improve Manufacturability
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1827ST-3302E/EB&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1827st-3302e-eb-microchip-2641256
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP1827ST-3302E/EB&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--analog--regulators-reference--linear-regulators/mcp1827st-3302e-eb-microchip-2641256
Microchip MCP1827ST-3302E/EB - Caractéristiques techniques
| Input Voltage-Min: | 2.3V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 3.3V |
| Output Current-Max: | 1.5A |
| Style d'emballage : | TO-263-4 (DDPAK) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
750 par Reel
Style d'emballage :
TO-263-4 (DDPAK)
Méthode de montage :
Surface Mount