Manufacturer Part #
MCP2515T-I/ST
MCP2515 Series 5.5 V 1 Mb/s Stand Alone SPI Interface CAN Controller- TSSOP-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:2500 per Reel Package Style:TSSOP-20 Mounting Method:Surface Mount |
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| Date Code: | 2526 | ||||||||||
Microchip MCP2515T-I/ST - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material for MCP2515-E/ST, MCP2515-E/STRB2, MCP2515-E/STRB4, MCP2515-I/ST, MCP2515-I/STRB2, MCP2515-I/STRB4, MCP2515T-E/ST, MCP2515T-E/STRB2, MCP2515T-E/STRB4, MCP2515T-I/ST, MCP2515T-I/STRB2 and MCP2515T-I/STRB4 catalog part numbers (CPN) available in 20L TSSOP (4.4mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach materialEstimated Qualification Completion Date: July 2026
Product Category: CAN ControllerDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515E/STRB4, MCP2515T E/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515-I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAOcatalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated Qualification Completion Date: October 2026
Part Status:
Microchip MCP2515T-I/ST - Technical Attributes
| Interface: | SPI |
| Data Rate-Max: | 1MBd |
| Supply Voltage-Nom: | 2.7V to 5.5V |
| Package Style: | TSSOP-20 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Microchip’s product line is the solution for your embedded design needs. From cost-competitive Analog and Memory devices to performance PIC® Microcontrollers (MCUs) and dsPIC® Digital Signal Controllers (DSCs), their devices provide a custom fit in your cost sensitive design. Quickly integrate their devices into applications from simple to complex. Their starter kits and free reference designs can help get you going.
CAN (control-area network) is a broadcast serial bus standard for connecting nodes. Each node is able to send and receive messages, but not simultaneously.: a message is transmitted serially onto the bus, one bit after another. The devices that are connected by a CAN network are typically sensors, actuators and control devices.
Available Packaging
Package Qty:
2500 per Reel
Package Style:
TSSOP-20
Mounting Method:
Surface Mount