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Manufacturer Part #
24LC64-I/SM
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90 per Tube
SOIJ-8
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change:Qualification of QMI-519 die attach material at MTAI assembly site for 24LC32A/SM, 24LC32A-E/SM, 24AA32AT-I/SM, 24LC32AT/SM, 24AA64T-I/SM, 24LC64T-E/SM, 24AA32AT/SM, 24LC64T-I/SM, 24FC64-I/SM, 24FC64T-I/SM, 24LC64-I/SM, 24LC64-E/SM, 24AA64-I/SM, 24AA32A-I/SM, 24LC32A-I/SM, 24LC32AT-I/SM, 24LC32AT-E/SM, 24AA64T-E/SM and 24AA64-E/SM catalog part numbers (CPN) available in 8L SOIJ (.208in) package.Reason for Change:To improve manufacturability and on time delivery performance by qualifying QMI-519 die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Description of Change:1. Updated TABLE 1-1: DC CHARACTERISTICS.2. Editorial updates throughout document.Reason for Change: To improve productivity.
Part Status:
The 24LC64F series of 64 Kbit Electrically Erasable PROM is organized as a single block of 8 K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 2.5 V, with standby and read currents of only 1 μA and 400 μA,respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition.
The 24LC64F also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24LC64F is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, TDFN and MSOP packages. The 24LC64F is also available in the 5-lead SOT-23 package.
Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.