Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
AT24C16D-SSHM-B
AT24C16D Series 16 Kb (2K x 8) 3.6V I2C-Compatible (2-Wire) Serial EEPROM-SOIC-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube | ||||||||||
| Date Code: | |||||||||||
Microchip AT24C16D-SSHM-B - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113340 ***Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach materialRevision History: May 30, 2025: Issued final notificationJune 06, 2025: Re-issued final notification. Updated to Qualification Report Summary in Qual Report attachment.
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C16D-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/at24c16d-sshm-b-microchip-5107013
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=AT24C16D-SSHM-B&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--memory--RAM--nvram--quantum-trap-nvsram/at24c16d-sshm-b-microchip-5107013
Available Packaging
Package Qty:
100 per Tube