Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
23LC1024T-I/SN
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
3300 par Reel
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
***UPDATE OF PCN118083***Revision History: December 15, 2025: Issued initial notification. April 15, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 22, 2026.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material selected 23A1024, 23A512, 23LC1024, 23LC512, 23LCV1024 and 23LCV512 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire materialEstimated First Ship Date: 22 May 2026 (date code: 2621)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material selected 23A1024, 23A512, 23LC1024, 23LC512, 23LCV1024 and 23LCV512 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Updated section 3.6: Hold, Serial I/O 3 (HOLD/SIO3)Reason for Change: To Improve Productivity
Statut du produit:
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
