
Manufacturer Part #
DSPIC33EP512MU810-I/PT
dsPIC33EP Series 52kB RAM 536 kB Flash 16-Bit Digital Signal Controller-TQFP-100
Microchip DSPIC33EP512MU810-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip DSPIC33EP512MU810-I/PT - Technical Attributes
Family Name: | dsPIC33EP |
Core Processor: | dsPIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 536kB |
RAM Size: | 52kB |
Speed: | 70MHz |
No of I/O Lines: | 83 |
InterfaceType / Connectivity: | CAN/IrDA/I2C/LIN/QEI/SPI/UART/USART/USB OTG |
Peripherals: | Brown-out Detect/DMA/Motor Control PWM/POR/PWM/Reset/Watchdog |
Number Of Timers: | 9 |
Supply Voltage: | 3V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 32-chx10-bit / 32-chx12-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-100 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
119 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount