Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
PIC24EP512GU810-I/PF
PIC24 Series 24 kB RAM 512 kB Flash 16-Bit Flash Microcontroller - TQFP-100
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2539 | ||||||||||
Microchip PIC24EP512GU810-I/PF - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24EP512GU810-I/PF&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24ep512gu810-i-pf-microchip-4013514
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC24EP512GU810-I/PF&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--16-bit-general-purpose/pic24ep512gu810-i-pf-microchip-4013514
Microchip PIC24EP512GU810-I/PF - Technical Attributes
| Family Name: | PIC24E |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 512kB |
| RAM Size: | 24kB |
| Speed: | 60MHz |
| No of I/O Lines: | 83 |
| InterfaceType / Connectivity: | CAN/I2C/SPI/UART/USB |
| Peripherals: | Analog Comparators/CAN/I2C/On-Chip-ADC/PWM/SPI/UART/USB/Watchdog |
| Number Of Timers: | 9 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 2(32-chx10-bit) |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC24EP512GU810-I/PF is a High Performance, 16 bit Digital Signal Controller with 24 KB RAM and 512 KB Flash, available in TQFP-100 package.
Features:
- High-Performance DSC CPU:
- 16-bit wide data path
- 24-bit wide instructions
- 16 x 16 fractional/integer multiply operations
- 32/16 and 16/16 divide operations
- Direct Memory Access:
- 15-Channel Hardware DMA
- Up to 4 Kbytes Dual Ported DMA Buffer Area (DPSRAM) to store data transferred via DMA
- Interrupt Controller:
- 13-Cycle Fixed Latency or 9- to 13-Cycle Variable Latency
- Up to 116 Available Interrupt Sources
- Up to Five External Interrupts
- Digital I/O:
- Peripheral Pin Select (PPS) Functionality
- Wake-up/Interrupt-on-Change for up to 122 pins
- System Management:
- Flexible Clock Options
- Programmable Power-up Timer
- Oscillator Start-up Timer
- Watchdog Timer with its own RC Oscillator
- CMOS Flash Technology:
- Low-Power, High-Speed Flash Technology
- Fully Static Design
- 3.3V (±10%) Operating Voltage
- Special Features:
- Flexible configuration
- Watchdog Timer (WDT)
- Code Protection and CodeGuard™ Security
- JTAG Boundary Scan Interface
- In-Circuit Serial Programming™ (ICSP™)
- In-Circuit emulation
Available Packaging
Package Qty:
90 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount
