Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
ATSAME53N20A-AUT-EFP
IC MCU 32BIT 1MB FLASH 100TQFP
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip ATSAME53N20A-AUT-EFP - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Errata for the SAM D5x/E5x Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: The following errata were added in this revision:? Device: 2.6.10 Power UpImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 01 Mar 2023
Microchip has released a new Errata for the SAM D5x/E5x Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: The following errata were added in this revision:? SERCOM: 2.18.26 SERCOM-USART LIN Host Delays? SERCOM: 2.18.27 SERCOM-USART Two Stop Bits in LIN Host The following errata were updated with new verbiage in this revision:? Device: Detection of a Debugger Probe 2.6.3? SUPC: Buck Converter Mode 2.19.1Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 12 Dec 2022
Microchip has released a new Errata for the SAM D5x E5x Family Silicon Errata and Data Sheet Clarification of devices.Revision History:October 14, 2022: Updated "Date Document Change Effective" to "Estimated First Ship Date".Description of Change: The following updates were implemented in this revision along with numerous typographical corrections: ?Updated the silicon revision throughout the document to F ? Deprecated DAC errata for Smoothing of the Output Signal in Differential Mode The following errata were added in this revision: ? ADC: Internal Bandgap Reference 2.1.6 ? CAN: Transmit Cancellation 2.4.14 ? Device: Standby Mode 2.6.9 ? DAC: Refresh Mode 2.9.7 ? NVMCTRL: Debugger Illegal Accesses 2.14.3 ? TCC: STATUS Register Access 2.21.9 ? TCC: Sequence State 2.21.10 ? EVSYS: Synchronous/Resynchronized Modes 2.24.3 ? OSC32KCTRL: Clock Switch Back Feature Limitation 2.26.1 ? OSCCTRL: Clock Switch Back Feature Limitation 2.27.1 The following Data Sheet Clarifications were added in this revision: ? I/O Pins Maximum Output Current Table 54-1Reason for Change: To Improve Productivity
Microchip has released a new Errata for the SAM D5x E5x Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: The following updates were implemented in this revision along with numerous typographical corrections: ?Updated the silicon revision throughout the document to F ? Deprecated DAC errata for Smoothing of the Output Signal in DifferentialMode The following errata were added in this revision: ? ADC: Internal Bandgap Reference 2.1.6 ? CAN: Transmit Cancellation 2.4.14 ?Device: Standby Mode 2.6.9 ? DAC: Refresh Mode 2.9.7 ? NVMCTRL: Debugger Illegal Accesses 2.14.3 ? TCC: STATUS Register Access2.21.9 ? TCC: Sequence State 2.21.10 ? EVSYS: Synchronous/Resynchronized Modes 2.24.3 ? OSC32KCTRL: Clock Switch Back FeatureLimitation 2.26.1 ? OSCCTRL: Clock Switch Back Feature Limitation 2.27.1 The following Data Sheet Clarifications were added in thisrevision: ? I/O Pins Maximum Output Current Table 54-1Reason for Change: To Improve Productivity
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATSAME53N20A-AUT-EFP&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--microcontrollers--32-bit/atsame53n20a-aut-efp-microchip-9197551
Available Packaging
Package Qty:
1000 per Reel