
Manufacturer Part #
PIC16F18854-E/SS
PIC16F Series 7 kB Flash 512 B RAM 32 MHz 8-Bit Microcontroller - SSOP-28
Microchip PIC16F18854-E/SS - Product Specification
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PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Part Status:
Microchip PIC16F18854-E/SS - Technical Attributes
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 7kB |
RAM Size: | 512B |
Speed: | 32MHz |
No of I/O Lines: | 25 |
InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
Peripherals: | Brownout Reset/Brown-out Detect/POR |
Number Of Timers: | 4 |
Supply Voltage: | 2.3V to 5.5V |
Operating Temperature: | -40°C to +125°C |
Watchdog Timers: | 1 |
Moisture Sensitivity Level: | 1 |
Package Style: | SSOP-28 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
47 per Tube
Package Style:
SSOP-28
Mounting Method:
Surface Mount