Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
MX29LV160DBTI-70G
MX29LV Series 16 Mb (2M x 8/1M x 16) 3 V 70 ns SMT Parallel Flash - TSOP-48
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Macronix | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:96 per Tray Package Style:TSOP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2532 | ||||||||||
Macronix MX29LV160DBTI-70G - Product Specification
Shipping Information:
ECCN:
PCN Information:
Change Descritption:Please be informed that Macronix?s assembly subcontractor?SPIL is ongoing to continue the assemblyfor Macronix TSOP and CSPpackage products for one year and take the last order on Aug. 30th, 2026,then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement --ChipMOS, OSE, ASECLand LINGSEN.For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026(last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027(last ship date).
Cancellation of Future PCN 115598 isued as Discontinuation. Change Descritption:Please be informed that Macronix?s assembly subcontractor?SPIL is ongoing to continue the assemblyfor Macronix TSOP and CSPpackage products for one year and take the last order on Aug. 30th, 2026,then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement --ChipMOS, OSE, ASECLand LINGSEN.For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026(last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipmentdatedesignated by the customer before Aug. 30th, 2027(last ship date).
Description:Please be informed that Macronix?s assembly subcontractor ? SPIL is ongoing to continue the assembly for Macronix TSOP and CSP package products for one year and take the last order on Aug. 30th, 2026, then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement -- ChipMOS, OSE, ASECL and LINGSEN. For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026 (last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027 (last ship date)Reason of Change:Due to capacity allocation, SPIL decided to EOL all Au wire assembly line, which includes Macronix? TSOP and CSP package production at SPIL.Last order date for SPIL TSOP and CSP package products: 2026/8/30Last shipping date for SPIL TSOP and CSP package products: 2027/8/30
Subject: Marking change for 32 pin PLCC, 32pin TSOP(1), 48pin TSOP(1) and 48 ball CSP package products.Change Category : Marking content changeReason of Change:This marking change is mainly to change the logo from ?MX? to ?MXIC? to be consistent with the logo on the invoice and web site, and also to align the logo in the marking of all other packaged products to avoid customer confusion
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX29LV160DBTI-70G&field4=Macronix&field18=https://p1na.futureelectronics.com/en/p/semiconductors--memory--flash--norflash--nor/mx29lv160dbti-70g-macronix-2415909
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX29LV160DBTI-70G&field4=Macronix&field18=https://p1na.futureelectronics.com/en/p/semiconductors--memory--flash--norflash--nor/mx29lv160dbti-70g-macronix-2415909
Macronix MX29LV160DBTI-70G - Technical Attributes
| Memory Density: | 16Mb |
| Memory Organization: | 2 M x 8 / 1 M x 16 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 70ns |
| Package Style: | TSOP-48 |
| Mounting Method: | Surface Mount |
Features & Applications
The MX29LV160DBTI-70G is a 16 M-Bit 3 V Supply Bottom Boot Block Parallel Flash memory. It's Operating Temerature Ranges from -40°C to +85°C.
Features:
- Byte/Word mode switchable
- 2,097,152 x8 / 1,048,576 x16
- Sector Structure
- 6 K-Byte x 1, 8 K-Byte x 2, 32 K-Byte x 1, 64 K-Byte x 31
- Provides sector protect function to prevent program or erase operation in the protected sector
- Provides chip unprotect function to allow code changing
- Provides temporary sector unprotect function for code changing in previously protected sector
- Power Supply Operation
- Vcc 2.7 to 3.6 volt for read, erase, and program operations
- Latch-up protected to 100 mA from -1 V to 1.5 x Vcc
- Low Vcc write inhibit : Vcc ≤ Vlko
- Compatible with JEDEC standard
- Pinout and software compatible to single power supply Flash
- Functional compatible with MX29LV160C device
Available Packaging
Package Qty:
96 per Tray
Package Style:
TSOP-48
Mounting Method:
Surface Mount