Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
PIC18LF27K42-I/ML
128KB Flash, 4KB RAM, 1KB EE, 12bit ADC2, Vector Interrupts, DMA, MAP, DIA -TUBE
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:VQFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC18LF27K42-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected PIC16F15344, PIC16F1535x, PIC16F1537x, PIC16F18346, PIC16F1885x, PIC16F1887x, PIC16F1919x, PIC18F24K4x, PIC18F25K4x, PIC18F25K83, PIC18F26K4x, PIC18F26K83, PIC18F27K4x, PIC18F45K4x, PIC18F46K4x, PIC18F47K4x, PIC18F65K40, PIC18F66K40 and PIC18F67K40 device families available in various packages assembled at MTAI.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and QMI519 as a new die attach material assembled at MTAI.Estimated First Ship Date: 05 August 2025 (date code: 2532)
EOL Description:The PIC18LF27K42, PIC18LF47K42, PIC18LF57K42 device families available in 28L SSOP, 28L SOIC, 28L PDIP, 28L SPDIP, 28L and 48L QFN, 40L and 48L UQFN and 44L and 48L TQFP will be moving to End of Life (EOL) status effective today. These device families will no longer be offered after March 31, 2025. Please review the attached parts affected list below for details about replacement parts if applicable.Note: If replacement parts are not listed in the attached list please contact your Local Sales RepresentativeReason for EOL:No longer have manufacturing support for the CPN listed in the attachment.Estimated Effective Dates:Customers affected by this EOL notice are advised to place last time buy (LTB) orders as follows:Last date for bookings (LTB): November 15, 2024Last date for shipments (LTS): March 31, 2025
Microchip has released a new Errata for the PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated Module 1.2 Minimum VDD Specification for silicon revision A3.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18LF27K42-I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--8-bit/pic18lf27k42-i-ml-microchip-4117504
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18LF27K42-I/ML&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--8-bit/pic18lf27k42-i-ml-microchip-4117504
Microchip PIC18LF27K42-I/ML - Technical Attributes
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 8kB |
| Speed: | 64MHz |
| No of I/O Lines: | 25 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/DMA/HLVD/POR/PWM/Reset |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| Moisture Sensitivity Level: | 3 |
| Package Style: | VQFN-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
61 per Tube
Package Style:
VQFN-28
Mounting Method:
Surface Mount