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Manufacturer Part #
MCP4024T-503E/OT
MCP4024 Series 64 Tap Serial 50 kOhm Non-Volatile SMT Digital POT - SOT-23
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Std. Mfr. Pkg Package Style:SOT-23 (SC-59,TO-236) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP4024T-503E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
***UPDATE OF PCN113107***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)Revision History: May 16, 2025: Issued final notification.May 22, 2025: Re-issued final notification to update the Qualification Report.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP4014, MCP4024, MCP6421, MCP6471, MCP6481, MCP6491, MCP6V11xx, MCP6V16xx, MCP6V31xx, MCP6V36xx, MCP6V61xx, MCP6V66xx, MCP6V71xx, MCP6V76xx, MCP6V81xx, MCP6V86xx, MCP6V91xx, MCP6V96xx, MCP73811, MCP73812, MCP73831, MCP73832, MCP9501, MCP9502, MCP9503, MCP9504, MCP9509, MCP9800, MCP9802 and MIC333 device families in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP4024T-503E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--digital-potentiometers/mcp4024t-503e-ot-microchip-C016299068
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP4024T-503E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--digital-potentiometers/mcp4024t-503e-ot-microchip-C016299068
Microchip MCP4024T-503E/OT - Technical Attributes
| No of Positions: | 64 |
| No of Channels: | 1 |
| Interface: | Serial |
| Wiper Storage: | Non-Volatile |
| Resistance: | 50kΩ |
| Tolerance: | ±20% |
| Supply Voltage: | 2.7V to 5.5V |
| Supply Current: | 45µA |
| Operating Temp Range: | -40°C to +125°C |
| Wiper Resistance: | 325Ω |
| Temp Coefficient (ppm/C): | 150ppm/°C |
| Package Style: | SOT-23 (SC-59,TO-236) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Std. Mfr. Pkg
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount