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Manufacturer Part #
TC1427COA
TC1427 Series 1.2 A 16 Vmax Dual Low Side Non Inverting MOSFET Driver - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip TC1427COA - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Cancellation Notification:Description of Change:This qualification was originally performed to qualify a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=TC1427COA&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1427coa-microchip-3474889
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=TC1427COA&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1427coa-microchip-3474889
Microchip TC1427COA - Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 8Ω |
| Peak Output Current: | 1.2A |
| Supply Voltage-Max: | 16V |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- Low Cost
- Latch-Up Protected: Will Withstand 500mA Reverse Output Current
- ESD Protected ±2kV
- High Peak Output Current: 1.2A
- Wide Operating Range: 4.5V to 16V
- High Capacitive Load Drive Capability: 1000pF in 38nsec
- Low Delay Time: 75nsec Max
- Logic Input Threshold Independent of Supply Voltage
- Output Voltage Swing to Within 25mV of Ground or VDD
- Low Output Impedance: 8Ω
Applications:
- Power MOSFET Drivers
- Switched Mode Power Supplies
- Pulse Transformer Drive
- Small Motor Controls
- Print Head Drive
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount