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Manufacturer Part #
MCP100T-475I/TT
MCP100 Series 4.75 V 150 ms Microcontroller Supervisory Circuit - SOT-23-3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23 (SC-59,TO-236) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP100T-475I/TT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
***UPDATE OF PCN114280***Revision History: May 28, 2025: Issued initial notification. July 7, 2025: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.July 14, 2025: Re-issued final notification to update the year of Final Issuance date.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.
*** Update for PCN 113228 ***Revision History: May 28, 2025: Issued initial notification. July 7, 2024: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 24 July 2025 (date code: 2530)
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of 84-3J/8006NS as a new die attach material for selected MCP10xT, MCP12xT and MCP13xT device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying 84-3J/8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:February 28, 2023 (date code: 2309)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP100T-475I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--system-management--voltage-supervisors/mcp100t-475i-tt-microchip-9321589
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP100T-475I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/es/p/semiconductors--analog--system-management--voltage-supervisors/mcp100t-475i-tt-microchip-9321589
Microchip MCP100T-475I/TT - Technical Attributes
| No of Outputs: | Single |
| Threshold Voltage: | 4.75|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 150ms |
| Package Style: | SOT-23 (SC-59,TO-236) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP100 series of voltage supervisory device is designed to keep a microcontroller in reset until the system voltage has reached the proper level and stabilized. It also operates as protection from brown-out conditions when the supply voltage drops below a safe operating level.
MCP100 has a CMOS Push-Pull output with Active Low reset and is available in a choice of seven different trip voltages. It operates over the extended industrial temperature range (-40° C/+85° C). MCP100 is available in a TO-92 or SOT23-3 packages.
Features:
- Holds microcontroller in reset untill supply vlotage reaches stable operating level
- Resets microcontroller during power loss
- Precision monitoring of 3 V, 3.3 V and 5 V systems
- 7 voltage trip point available
- Active low RESET(bar)/[MCP100] or active high RESET(MCP101)
- Push-pull output
- Holds RESET(bar)/[MCP100] for 350 ms (typical)
- RESET(bar)/[MCP100] to Vdd = 1.0 V
- Accuracy of ±125 mV for 5 V systems and ±75 mV for 3 V systems over temperature
- 45 µA typical operating current
- Temperature range:
- Industrial (I): -40º C to +85º C
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount