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Référence fabricant
APT150GN60JDQ4
APT150GN60JDQ Series 600 V 220 A Trench and Field Stop IGBT - SOT-227
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Tube Style d'emballage :SOT-227 Méthode de montage :Chassis Mount | ||||||||||
| Code de date: | |||||||||||
Microchip APT150GN60JDQ4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT150GN60JDQ4&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--discretes--transistors--igbts/apt150gn60jdq4-microchip-2034610
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT150GN60JDQ4&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--discretes--transistors--igbts/apt150gn60jdq4-microchip-2034610
Microchip APT150GN60JDQ4 - Caractéristiques techniques
| CE Voltage-Max: | 600V |
| Collector Current @ 25C: | 220A |
| Power Dissipation-Tot: | 536W |
| Gate - Emitter Voltage: | ±30V |
| Pulsed Collector Current: | 450A |
| Collector - Emitter Saturation Voltage: | 1.45V |
| Turn-on Delay Time: | 44ns |
| Turn-off Delay Time: | 430ns |
| Qg Gate Charge: | 970nC |
| Reverse Recovery Time-Max: | 160ns |
| Leakage Current: | 600nA |
| Input Capacitance: | 9200pF |
| Thermal Resistance: | 0.28°C/W |
| Operating Temp Range: | -55°C to +175°C |
| No of Terminals: | 4 |
| Style d'emballage : | SOT-227 |
| Méthode de montage : | Chassis Mount |
Emballages disponibles
Qté d'emballage(s) :
1 par Tube
Style d'emballage :
SOT-227
Méthode de montage :
Chassis Mount