Manufacturer Part #
FF17MR12W1M1HPB11BPSA1
1200 V 50 A Chassis Mount DuelPack Module CoolSiC Trench Mosfet - AG-EASY1B
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Bulk Package Style:Module Mounting Method:Chassis Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Infineon FF17MR12W1M1HPB11BPSA1 - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
Wafer Size Change
04/02/2025 Details and Download
Location Change
02/05/2025 Details and Download
Description:Introduction of an additional wafer production location at Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia for products with CoolSiC™ MOSFET 1200V Gen. 1.Reason for change:Introduction of an additional wafer production location at Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia for products with CoolSiC™ MOSFET 1200V Gen. 1.PCN update of PCN110386
Part Status:
Active
Active
Infineon FF17MR12W1M1HPB11BPSA1 - Technical Attributes
Attributes Table
| Technology: | SiCFET (Silicon Carbide) |
| Gate-Source Voltage-Max [Vgss]: | 23V |
| Isolation Voltage-RMS: | 3000V |
| Drain-to-Source Voltage [Vdss]: | 1200V |
| Drain Current: | 50A |
| Configuration: | Half Bridge |
| Operating Temp Range: | -40°C to +175°C |
| Package Style: | Module |
| Mounting Method: | Chassis Mount |
Pricing Section
Global Stock:
0
Germany:
0
On Order:
0
Factory Lead Time:
8 Weeks
Quantity
Unit Price
1
$54.26
4
$53.50
15
$52.79
25
$52.52
50+
$51.67
Product Variant Information section
Available Packaging
Package Qty:
1 per Bulk
Package Style:
Module
Mounting Method:
Chassis Mount