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Manufacturer Part #
24FC02-I/SN
24FC02 Series 2 Kbit (256 x 8) 1.7 V 1 MHz Surface Mount I²C EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 24FC02-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 116117 ***Revision History:October 13, 2025: Re-issued to update the affected CPN listDescription of Change:Microchip has released a new Datasheet for the 24AA02/24LC02B/24FC02 - 2-Kbit I2C Serial EEPROM of devices.Added 4 million E/W cycles for FC devices only; Added Q6B package outline drawing; Minor editorial updates throughout the document.Date Document Changes Effective: 22 Sep 2025
*** Update for PCN 113340 ***Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach materialRevision History: May 30, 2025: Issued final notificationJune 06, 2025: Re-issued final notification. Updated to Qualification Report Summary in Qual Report attachment.
Description of Change: Qualification of CuPdAu as a new wire material and QMI519 as a new die attach material for selected 24AA01, 24AA01H, 24AA02, 24AA02H, 24AA04, 24AA04H, 24AA08, 24AA08H, 24AA16, 24AA16H, 24FC01, 24FC02, 24FC04, 24FC04H, 24FC08, 24FC16, 24FC16H, 24LC01B, 24LC01BH, 24LC02B, 24LC02BH, 24LC04B, 24LC04BH, 24LC08B, 24LC08BH, 24LC16B, 24LC16BH, 25AA320A, 25AA640A, 25CS320, 25CS640, 25LC320A, 25LC640A, AT24C01D, AT24C02D, AT24C04D, AT24C08C, AT24C08D, AT24C16C, AT24C16D and AT24C32E device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability CuPdAu as a new wire material and QMI519 as a new die attach material
Part Status:
Microchip 24FC02-I/SN - Technical Attributes
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C / Serial |
| Access Time-Max: | 450ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount